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                Published: Aug 15, 2022
                    Updated: Aug 15, 2022
                
Foundation for Innovative Packaging and Sustainability (FIPS), a non-government, non- profit organisation established in 2020 with its registered office in Mumbai, whose founder-chairman is Prof NC Saha, will be organising India’s pioneering International Conference on RESPACK (Responsible Packaging — Optimal Design, Innovative Materials & Sustainable Technology) at Hotel The Lalit, Barakhamba Road, New Delhi on September 9 and 10. The main objective of the conference is to highlight the importance of Responsible Design, Responsible Materials and Responsible Technology to mitigate marine pollution due to post-consumer packaging waste. It is expected that about 200 participants, consisting of packaging raw materials converters, brand owners, scientists, academicians and start-ups will participate in the conference.
The detailed programme with speakers and their topics is given below:
                            Opening Session 
                            Chief Guest: Dr Srivari Chandrasekhar,
                            Secretary, Dept of Science & Technology, Ministry of Science & Technology, Govt of
                            IndiaSpecial
                            Guest of Honour: Dr Arun
                            Kumar Sarma, Director General, NECTAR, DST, Govt of IndiaGuest of Honour: Mr Rajani Ranjan
                            Rashmi,
                            Retd IAS, former
                            Chief Secretary, Manipur, Govt of India and Mentor, FIPSGuest of Honour: Dr U Venkateswarlu,
                            Retd
                            IAS, former Chief
                            Secretary, Tripura, Govt of India and Mentor, FIPSSpecial Guest: Mr Arvind Mehta, Chairman,
                            Governing Council,
                            AIPMASpecial Guest: Mr Diwakar Shetty, Chairman, Shetron & Vice President, MCMA
                        
 
                    Launch of FIPS Award (FIPSA) on Responsible Packaging: Special Guest: Prof Dhiraj Kumar, Director, National Institute of Design, NIDMP
Technical Sessions
 
                     
                     
  September 30, 2025 - Combined Issue
 
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